Heat transfer through an individual layer of a semiconductor module
Simscape / Electrical / Passive / Thermal
The Cauer Thermal Model Element block represents heat transfer through an individual layer of a semiconductor module. The figure shows an equivalent circuit for a Cauer Thermal Model Element block.
A Cauer thermal model represents the multiple layers that constitute the packaging of a semiconductor. Layers include chip, solder, substrate, solder, and base. Other terms that describe a Cauer thermal model are:
Continued fraction circuit
To create a Cauer thermal model, connect multiple instances of the Cauer Thermal Model Element block in series. In the figure of the Cauer thermal model, Tj is the junction temperature and Tc is the base plate temperature.
The defining equations for the Cauer Thermal Model Element block are
Cthermal is the thermal capacity.
τ is the thermal time constant.
Rthermal is the thermal resistance.
QAB is the heat flow through the material.
TAB is the temperature difference between the material layers.
QAR is the heat flow through the thermal capacity.
TAR is the temperature drop across the thermal capacity.
Use the Variables settings to specify the priority and initial target values for the block variables before simulation. For more information, see Set Priority and Initial Target for Block Variables.
Unlike block parameters, variables do not have conditional visibility. The Variables settings include all the existing block variables. If a variable is not used in the set of equations corresponding to the selected block configuration, the values specified for this variable are ignored.
A— First surface of the semiconductor individual layer
Thermal conserving port associated with the first surface of the individual layer of the semiconductor.
R— Thermal reference
Thermal conserving port associated with the chosen thermal reference.
B— Second surface of the semiconductor individual layer
Thermal conserving port associated with the second surface of the individual layer of the semiconductor.
Thermal resistance— Thermal resistance
Thermal resistance, Rthermal.
Thermal time constant— Thermal time constant
Thermal time constant, τ.
 Schütze, T. AN2008-03: Thermal equivalent circuit models. Application Note. V1.0. Germany: Infineon Technologies AG, 2008.